Electro Mechanical

75GHz Clamshell Socket for NXP's BGA141

75GHz Clamshell Socket for NXP's BGA141

Written by: Ironwood Electronics | 08.01.2017

Quickly and easily Socket your 0.65mm pitch 13x13 array, 141BGA packages on any application board with performance equivalent to direct solder version

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Flyover QSFP28 Technical Paper and PCIe®-Over-FireFly™ Product Demonstration at DesignCon 2017

Flyover QSFP28 Technical Paper and PCIe®-Over-FireFly™ Product Demonstration at DesignCon 2017

Written by: Danny Boesing | 25.12.2016

DesignCon 2017 is right around the corner.  As in past years, Samtec will have a large presence throughout the event.  Our SI experts will present technical papers.  Our application engineers will demonstrate new system-level solutions.  Our product experts will discuss various new and emerging products that will be released throughout 2017.

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Samtec FireFly™ Enables Cascading of Guzik DP 7000 Digital Processors

Samtec FireFly™ Enables Cascading of Guzik DP 7000 Digital Processors

Written by: Matt Burns, Samtec | 21.12.2016

The computing demands of high-performance applications like HPC, machine learning and high-speed communications are driven by the CPU architectures championed by Moore’s Law.  As that has slowed, additional processing architectures such as GPUs, DSPs and FPGAs have become commonplace in data center acceleration applications.

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 Thermally conductive foils cut to customer-specific requirements

Thermally conductive foils cut to customer-specific requirements

Written by:  | 07.11.2016

Fischer Elektronik will cut your drawing parts precisely to the desired geometry in keeping with your specifications, regardless of whether they are made from sheet or roller material. You can meanwhile rely on Fischer's newly introduced 24-hour sample service for custom cuts created from our standard thermally conductive materials in accordance with your specifications.

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Investing in HDI flex technology

Investing in HDI flex technology

Written by: Electro Mechanical  | 13.09.2016

In June of last year, PFC was pleased to announce the purchase of ESI’s Model 5335 Laser Processing System. With this new investment, PFC was able to support true HDI flex technologies for which there is strong market interest across multiple industries ranging from consumer and medical device, to military and aerospace. The laser has facilitated higher precision drilling at faster speeds.

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Chip Size 0.65mm Pitch BGA Socket Adapter for BGA500

Chip Size 0.65mm Pitch BGA Socket Adapter for BGA500

Written by: Electro Mechanical | 21.04.2015

onwood Electronics' new high performance socket - SFS-BGA500C-52 allows 0.65mm pitch, 14x17mm body, 20X25 array 500 ball BGA package to be placed in socket and operated without compromising performance in high speed applications.

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75GHz Clamshell BGA Socket with Heat Sink Lid

75GHz Clamshell BGA Socket with Heat Sink Lid

Written by: Electro Mechanical | 13.03.2015

Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75GHz, very low inductance and wide temperature applications. The GT-BGA-2019 socket is designed for 25x25 mm package size and operates at bandwidths up to 75GHz with

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Ironwood Electronics introduces 40GHz gold plated wire in elastomer socket

Ironwood Electronics introduces 40GHz gold plated wire in elastomer socket

Written by: Electro Mechanical | 11.02.2015

Ironwood Electronics has extended its embedded gold plated wire elastomer (SG) socket line with SG15 and SG25 versions that provides up to 40 GHz bandwidth in a small, cost effective ZIF socket for prototype and test applications.

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Sockets for High Speed Applications

Sockets for High Speed Applications

Written by: Electro Mechanical | 07.01.2015

BGA sockets and QFN sockets using GT contact technology provide >75GHz signal speed in a smallest footprint for prototype and test applications. These sockets support pitches from 0.15mm to 1.27mm. Standard sizes typically ship within 5 days ARO.

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Quickly and easily Socket your 27x27mm, 0.8mm pitch BGA packages on any application board with performance equivalent to direct solder version

Quickly and easily Socket your 27x27mm, 0.8mm pitch BGA packages on any application board with performance equivalent to direct solder version

Written by: Electro Mechanical | 24.12.2014

Ironwood Electronics has recently introduced a new BGA socket design using high performance elastomer capable of 75 GHz, very low inductance and wide temperature applications.

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Quickly and easily Socket your 10x10mm, 0.5mm pitch QFN packages on any application board with performance equivalent to direct solder version

Quickly and easily Socket your 10x10mm, 0.5mm pitch QFN packages on any application board with performance equivalent to direct solder version

Written by: Electro Mechanical | 14.12.2014

Ironwood Electronics has recently introduced a new QFN socket design using high performance elastomer capable of 40 GHz, very low inductance,high endurance and wide temperature applications.

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Quickly and easily Socket your 0.8mm pitch, 9x16mm BGA package on any PCB without significant performance loss

Quickly and easily Socket your 0.8mm pitch, 9x16mm BGA package on any PCB without significant performance loss

Written by: Electro Mechanical | 14.12.2014

Ironwood Electronics has recently introduced a new high performance BGA socket for 0.8mm pitch, 96 pin BGA IC's.

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 MICON-Switch

MICON-Switch

Written by: Electro Mechanical | 06.11.2014

This ingenious, patent-pending, automatic switch can save great headache for customers who have a need to switch a source signal between an external port and an internal port.

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Quickly and easily Socket your 0.8mm pitch, 9x16mm BGA package on any PCB withoutsignificant performance loss

Quickly and easily Socket your 0.8mm pitch, 9x16mm BGA package on any PCB withoutsignificant performance loss

Written by: Electro Mechanical | 15.09.2014

Ironwood Electronics has recently introduced anew high performance BGA socket for 0.8mm pitch, 96 pin BGA IC's.

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Debugging of 28lead SOIC is made easier with CA-SO28E-Z-J-01 Carrier Adapter with chip

Debugging of 28lead SOIC is made easier with CA-SO28E-Z-J-01 Carrier Adapter with chip

Written by: Electro Mechanical | 09.09.2014

Ironwood Electronics' SOIC Carrier Adaptors make it easy to probe, and quickly switch IC's on a board with SMT lands only.

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Dr. Day from Coto Technology explains RedRock

Dr. Day from Coto Technology explains RedRock

Written by:  | 28.07.2014

Dr. Day from Coto Technology explains RedRock

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Ironwood Electronics extended its high performance socket product line with smart features.

Ironwood Electronics extended its high performance socket product line with smart features.

Written by: Electro Mechanical | 18.07.2014

Sockets are typically rated for 2K to 500K cycles. How do we know if the sockets are used for 100K or 200K insertions? Solution is electronic chip insertion counter.

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8GHz Bandwidth Socket for Xilinx FFVJ/FHGE/FHGJ1924 BGA Package

8GHz Bandwidth Socket for Xilinx FFVJ/FHGE/FHGJ1924 BGA Package

Written by: Electro Mechanical | 18.07.2014

Quickly and easily Socket your 45mm square and 47.5mm square, 1mm pitch Xilinx BGA packages on any PCB without significant performance lossIronwood Electronics has recently introduced a new high performance BGA socket for 1mm pitch, 1924 pin BGA IC's.

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